We provide SMD assembly services, flexibly responding to our customers’ needs and using the knowledge and professionalism of our specialists to achieve the best results.
Surface-mount devices are built with YAMAHA YS12, YSM20R and YSM20 high-precision machines.
Technical capabilities of the devices: part housing from 0.3x0.15 mm to 45x100 mm, height – up to 15 mm; maximum printed circuit board dimensions – 300x450 mm; there is the possibility of mounting ball grid array (BGA) components.
SMD components are soldered with the Seho GoReflow 2.3 convection soldering system or an IBL SV 360 vapour phase soldering machine (which is especially good for BGA-style parts).
The mounting accuracy of SMD components is checked with a Nordson Yestech BX AOI automated optical inspection device.
